Thank you for taking an interest in the various military and defense parts, aerospace parts, and other items that we offer. You have reached the RFQ page for part number HMC284MS8G, a Hittite Microwave Corporation item with the NSN 5962015764945 that is listed alongside the description “Microcircuit Linear.” If you are interested in part number HMC284MS8G and wish to learn more about your purchasing options, be sure to submit the form below at your earliest convenience while supplying us with important information concerning your needs and restrictions alike. Once we have a chance to receive and review your completed form, a member of our staff will reach out to you in 15 minutes or less to present a tailored solution for your comparisons.
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To ensure that shopping with us is as simple as possible, we make it easy to identify and procure exact items by listing parts alongside all applicable designations and information. For example, part number HMC284MS8G is specifically listed with the NSN 5962-01-576-4945, and this code can be used to determine that it falls under FSC 5962 Microcircuits Electronic. Additionally, while tracing back to Hittite Microwave Corporation, this NSN part was specifically produced under CAGE Code 1CN88. With our services and dedication to simple procurement in mind, get started with us today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-576-4945 Item PartTypeName: MICROCIRCUIT,LINEAR | 5962 | 015764945 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 91793094 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CXCY | Part Name Assigned By Controlling Agency | LOW STRESS INJECTION MOLDED PLASTIC |
| MRC | Decoded Requirement | Clear Text Reply |
| FEAT | Special Features | LEADFRAME MATERIAL, COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND; THIS ITEM IS A LOW-COST SPDT SWITCH IN 8-LEAD GROUNDED BASE MSOP PACKAGES; THE DESIGM HAS BEEN OPTIMIZED TO PROVIDE HIGH ISOLATION WITH MINIMAL INSERTION LOSS FOR MEDIUM AND LOW POWER APPLICATIONS; ON-CHIP CIRCUITRY ALLOWS POSITIVE VOLTAGE CONTROL OPERATION AT VERY LOW DC CURRENTS WITH CONTROL INPUTS COMPATIBLE WITH CMOS AND MOST TTL LOGIC FAMILIES |
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