Thank you for taking an interest in the various military and defense parts, aerospace parts, and other items that we offer. You have reached the RFQ page for part number IDT6116LA55TDB, a Integrated Device Technology Inc item with the NSN 5962013498091 that is listed alongside the description “Microcircuit Memory.” If you are interested in part number IDT6116LA55TDB and wish to learn more about your purchasing options, be sure to submit the form below at your earliest convenience while supplying us with important information concerning your needs and restrictions alike. Once we have a chance to receive and review your completed form, a member of our staff will reach out to you in 15 minutes or less to present a tailored solution for your comparisons.
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To ensure that shopping with us is as simple as possible, we make it easy to identify and procure exact items by listing parts alongside all applicable designations and information. For example, part number IDT6116LA55TDB is specifically listed with the NSN 5962-01-349-8091, and this code can be used to determine that it falls under FSC 5962 Microcircuits Electronic. Additionally, while tracing back to Integrated Device Technology Inc, this NSN part was specifically produced under CAGE Code 61772. With our services and dedication to simple procurement in mind, get started with us today!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-349-8091 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013498091 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
IDT6116LA55TDB | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABMK | OVERALL WIDTH | 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFJQ | STORAGE TEMP RANGE | -55.0 TO 150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | 5895-01-325-7022 |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CTQX | CURRENT RATING PER CHARACTERISTIC | 85.00 MILLIAMPERES MAXIMUM SUPPLY |
ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
CZEQ | TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM ACCESS |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND STATIC OPERATION |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,MEMORY DIGITAL,STATIC RAM |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | RAM |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
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